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Wafer scale packaging of MEMS by using plasma activated wafer bonding

Vertaisarvioitu
Suni, Tommi; Henttinen, Kimmo; Lipsanen, Antti; Dekker, James; Luoto, Hannu; Kulawski, Martin
ECS Proceedings Volumes2005

Low-Temperature Wafer-Level Bonding with Cu-Sn-In Solid Liquid Interdiffusion for Microsystem Packaging

Vertaisarvioitu
Avoin saatavuus
DOI
10.1016/j.mee.2024.112140
Golim, Obert; Vuorinen, Vesa; Wernicke, Tobias; Pawlak, Marta; Paulasto-Kröckel, Mervi
Microelectronic Engineering2024

Wafer-Level AuSn and CuSn Bonding for MEMS Encapsulation

Vertaisarvioitu
Suni, Tommi; Xu, Hongbo; Vuorinen, V.; Heikkinen, Hannele; Vähänen, Sami; Jaakkola, Antti; Monnoyer,...
EMPC 20132013

Wafer level packaging of MEMS and 3D integration with CMOS for fabrication of timing microsystems

Vertaisarvioitu
DOI
10.1109/DTIP.2016.7514832
Manier, Charles-Alix; Zoschke, Kai; Wilke, Martin; Oppermann, Hermann; Ruffieux, David; Dalla Piazza...
18th Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 20162016

A 3-D packaging concept for cost effective packaging of MEMS and ASIC on wafer level

Avoin saatavuus
Baumgartner, Tobias; Töpper, Michael; Klein, Matthias; Schmid, Bernhard; Knödler, Dieter; Kuisma, He...
European Microelectronics and Packaging Conference & Exhibition, EMPC 20092009

Wafer level packaging for hermetical encapsulation of MEMS resonators

Vertaisarvioitu
DOI
10.1109/DTIP.2015.7161027
Manier, C.-A.; Zoschke, K.; Oppermann, H.; Ruffieux, D.; Dalla Piazza, Silvio; Suni, Tommi; Dekker, ...
17th Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 20152015

Hermetic wafer level packaging of MEMS components using through silicon via and wafer to wafer bonding technologies

Vertaisarvioitu
DOI
10.1109/ECTC.2013.6575770
Zoschke, K.; Manier, C.-A.; Wilke, M.; Jürgensen, N.; Oppermann, H.; Ruffieux, D.; Dekker, James; He...
Electronic Components and Technology Conference (ECTC)2013

Fabrication of silicon based through-wafer interconnects for advanced chip scale packaging

Vertaisarvioitu
DOI
10.1016/j.sna.2007.02.030
Ji, Fan; Leppävuori, Seppo; Luusua, Ismo; Henttinen, Kimmo; Eränen, Simo; Hietanen, Iiro; Juntunen, ...
Sensors and Actuators A: Physical2008

Optimization of contact metallizations for reliable wafer level Au[sbnd]Sn bonds

Vertaisarvioitu
DOI
10.1016/j.microrel.2016.07.013
Vuorinen, Vesa; Rautiainen, A.; Heikkinen, Harri; Paulasto-Kröckel, Mervi
Microelectronics reliability2016

Vacuum packaging at wafer level for MEMS using gold-tin metallurgy

Vertaisarvioitu
Manier, C.-A.; Zoschke, K.; Oppermann, H.; Ruffieux, D.; Dalla Piazza, S; Suni, Tommi; Dekker, James...
EMPC 20132013

Wafer scale packaging of MEMS by using plasma activated wafer bonding

Vertaisarvioitu
2005

Low-Temperature Wafer-Level Bonding with Cu-Sn-In Solid Liquid Interdiffusion for Microsystem Packaging

Vertaisarvioitu
Avoin saatavuus
DOI
10.1016/j.mee.2024.112140
2024

Wafer-Level AuSn and CuSn Bonding for MEMS Encapsulation

Vertaisarvioitu
2013

Wafer level packaging of MEMS and 3D integration with CMOS for fabrication of timing microsystems

Vertaisarvioitu
DOI
10.1109/DTIP.2016.7514832
2016

A 3-D packaging concept for cost effective packaging of MEMS and ASIC on wafer level

Avoin saatavuus
2009

Wafer level packaging for hermetical encapsulation of MEMS resonators

Vertaisarvioitu
DOI
10.1109/DTIP.2015.7161027
2015

Hermetic wafer level packaging of MEMS components using through silicon via and wafer to wafer bonding technologies

Vertaisarvioitu
DOI
10.1109/ECTC.2013.6575770
2013

Fabrication of silicon based through-wafer interconnects for advanced chip scale packaging

Vertaisarvioitu
DOI
10.1016/j.sna.2007.02.030
2008

Optimization of contact metallizations for reliable wafer level Au[sbnd]Sn bonds

Vertaisarvioitu
DOI
10.1016/j.microrel.2016.07.013
2016

Vacuum packaging at wafer level for MEMS using gold-tin metallurgy

Vertaisarvioitu
2013