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Optimization of contact metallizations for reliable wafer level Au[sbnd]Sn bonds

Vertaisarvioitu
DOI
10.1016/j.microrel.2016.07.013
Vuorinen, Vesa; Rautiainen, A.; Heikkinen, Harri; Paulasto-Kröckel, Mervi
Microelectronics reliability2016

Thermodynamic modeling of Au-Ce-Sn ternary system

Vertaisarvioitu
DOI
10.1016/j.calphad.2013.07.013
Dong, Hongqun; Tao, Xiaoma.; Laurila, Tomi; Vuorinen, Vesa; Paulasto-Kröckel, Mervi
Calphad: Computer Coupling of Phase Diagrams and Thermochemistry2013

Design for reliability of Au-Sn and Cu-Sn based SLID bonds

Vertaisarvioitu
Vuorinen, Vesa; Rautiainen, Antti; Paulasto-Kröckel, Mervi
European Microelectronics and Packaging Conference2016

Mechanical characterization of SLID bonded Au-Sn and Cu-Sn interconnections for MEMS packaging

Rautiainen, Antti; Österlund, Elmeri; Xu, Hongbo; Vuorinen, Vesa; Paulasto-Kröckel, Mervi
-2014

Reliability Performance of Au-Sn and Cu-Sn Wafer Level SLID Bonds for MEMS

Vertaisarvioitu
DOI
10.1109/ESTC.2014.6962771
Xu, Hongbo; Rautiainen, Antti; Vuorinen, Vesa; Österlund, Elmeri; Suni, Tommi; Heikkinen, Hannele; M...
Electronics system integration technology conference2014

Thermodynamic reassessment of Au-Ni-Sn ternary system

Vertaisarvioitu
DOI
10.1016/j.calphad.2013.10.001
Dong, Hongqun; Vuorinen, Vesa; Laurila, Tomi; Paulasto-Kröckel, Mervi
Calphad: Computer Coupling of Phase Diagrams and Thermochemistry2013

Utilizing Co as a contact metallization for wafer-level Cu-Sn-In SLID bonding used in MEMS and MOEMS packaging

Vertaisarvioitu
Avoin saatavuus
DOI
10.1109/ESTC55720.2022.9939539
Emadi, Fahimeh; Vuorinen, Vesa; Paulasto-Kröckel, Mervi
2022 IEEE 9th Electronics System-Integration Technology Conference, ESTC 2022 - Proceedings2022

Microstructural and mechanical characterization of Cu/Sn SLID bonding utilizing Co as contact metallization layer

Vertaisarvioitu
Avoin saatavuus
DOI
10.1016/j.jallcom.2022.167228
Emadi, F.; Vuorinen, V.; Mertin, Stefan; Widell, K.; Paulasto-Kröckel, M.
Journal of alloys and compounds2022

Microstructural evolution and mechanical properties of Au-20wt.%Sn|Ni interconnection

Vertaisarvioitu
DOI
10.1007/s11664-015-4152-3
Dong, Hongqun; Vuorinen, Vesa; Liu, Xuwen; Laurila, Tomi; Li, Jue; Paulasto-Kröckel, Mervi
Journal of Electronic Materials2016

Thermodynamic reassessment of the Au-Pt-Sn system and microstructural evolution of the (AuSn)eut-Pt interconnection

Vertaisarvioitu
DOI
10.1016/j.jallcom.2016.07.129
Dong, Hongqun; Vuorinen, Vesa; Broas, Mikael; Paulasto-Kröckel, Mervi
Journal of Alloys and Compounds2016

Optimization of contact metallizations for reliable wafer level Au[sbnd]Sn bonds

Vertaisarvioitu
DOI
10.1016/j.microrel.2016.07.013
2016

Thermodynamic modeling of Au-Ce-Sn ternary system

Vertaisarvioitu
DOI
10.1016/j.calphad.2013.07.013
2013

Design for reliability of Au-Sn and Cu-Sn based SLID bonds

Vertaisarvioitu
2016

Mechanical characterization of SLID bonded Au-Sn and Cu-Sn interconnections for MEMS packaging

2014

Reliability Performance of Au-Sn and Cu-Sn Wafer Level SLID Bonds for MEMS

Vertaisarvioitu
DOI
10.1109/ESTC.2014.6962771
2014

Thermodynamic reassessment of Au-Ni-Sn ternary system

Vertaisarvioitu
DOI
10.1016/j.calphad.2013.10.001
2013

Utilizing Co as a contact metallization for wafer-level Cu-Sn-In SLID bonding used in MEMS and MOEMS packaging

Vertaisarvioitu
Avoin saatavuus
DOI
10.1109/ESTC55720.2022.9939539
2022

Microstructural and mechanical characterization of Cu/Sn SLID bonding utilizing Co as contact metallization layer

Vertaisarvioitu
Avoin saatavuus
DOI
10.1016/j.jallcom.2022.167228
2022

Microstructural evolution and mechanical properties of Au-20wt.%Sn|Ni interconnection

Vertaisarvioitu
DOI
10.1007/s11664-015-4152-3
2016

Thermodynamic reassessment of the Au-Pt-Sn system and microstructural evolution of the (AuSn)eut-Pt interconnection

Vertaisarvioitu
DOI
10.1016/j.jallcom.2016.07.129
2016