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Modelling New Materials for Microelectronics Packaging

Vertaisarvioitu
Kivilahti, J.
IEEE Transactions on Components, Packaging and Manufacturing Technology - Part B1995

Training communication skills in project-oriented microelectronics courses

Vertaisarvioitu
DOI
10.1109/EWME.2014.6877387
Campi, Fabio; Neal, Vivian; Airoldi, Roberto; Nurmi, Jari
European Workshop on Microelectronics Education2014

Predicting bond failure after 1.5 ms of bonding, an initial study

Vertaisarvioitu
DOI
10.1016/j.microrel.2014.02.024
Tietavainen, Aino; Rauhala, Timo; Seppanen, Henri; Kurppa, Risto; Merilainen, Antti I.; Haeggstrom, ...
Microelectronics Reliability2014

Single-parameter model for the post-breakdown conduction characteristics of HoTiOx-based MIM capacitors

Vertaisarvioitu
DOI
10.1016/j.microrel.2014.07.067
Blasco, J.; Castan, H.; Garcia, H.; Duenas, S.; Sune, J.; Kemell, M.; Kukli, K.; Ritala, M.; Leskelä...
Microelectronics Reliability2014

Reliability of SMD interconnections on flexible low-temperature substrates with inkjet-printed conductors

Vertaisarvioitu
Avoin saatavuus
Putaala, Jussi ; Hannu, Jari ; Kunnari, Esa ; Mäntysalo, Matti ; Nousiainen, Olli ; Jantunen, Heli
Microelectronics reliability2014

Particle radiation in microelectronics

Avoin saatavuus
Javanainen, Arto
Research report / Department of Physics, University of Jyväskylä2012

Direct wafer bonding for MEMS and microelectronics: Dissertation

Avoin saatavuus
Suni, Tommi
VTT Publications2006

Modern facility for microelectronics research

Heleskivi, Jouni
Industrial Horizons1997

Microelectronics in Finland - Research and Education Strategy

Avoin saatavuus
Sauvola, Jaakko; Hyysalo, Jarkko; Pärssinen, Aarno; Kosunen, Marko; Mäntysalo, Matti; Tamminen, Alek...
Oulun yliopisto2025

Microelectronics and rural areas: the micropolis case

Harmaala, Mari
-2001

Modelling New Materials for Microelectronics Packaging

Vertaisarvioitu
1995

Training communication skills in project-oriented microelectronics courses

Vertaisarvioitu
DOI
10.1109/EWME.2014.6877387
2014

Predicting bond failure after 1.5 ms of bonding, an initial study

Vertaisarvioitu
DOI
10.1016/j.microrel.2014.02.024
2014

Single-parameter model for the post-breakdown conduction characteristics of HoTiOx-based MIM capacitors

Vertaisarvioitu
DOI
10.1016/j.microrel.2014.07.067
2014

Reliability of SMD interconnections on flexible low-temperature substrates with inkjet-printed conductors

Vertaisarvioitu
Avoin saatavuus
2014

Particle radiation in microelectronics

Avoin saatavuus
2012

Direct wafer bonding for MEMS and microelectronics: Dissertation

Avoin saatavuus
2006

Modern facility for microelectronics research

1997

Microelectronics in Finland - Research and Education Strategy

Avoin saatavuus
2025

Microelectronics and rural areas: the micropolis case

2001