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Hermetic packaging for millimetre wave applications

Vertaisarvioitu
Lahti, Markku; Kautio, Kari; Ollila, Jyrki; Vähä-Heikkilä, Tauno; Kaunisto, Mikko
EMPC 20132013

Printed intelligence in packaging

Hurme, Eero; Sipiläinen-Malm, Thea
Paper360°2007

Hermetic wafer level packaging of MEMS components using through silicon via and wafer to wafer bonding technologies

Vertaisarvioitu
DOI
10.1109/ECTC.2013.6575770
Zoschke, K.; Manier, C.-A.; Wilke, M.; Jürgensen, N.; Oppermann, H.; Ruffieux, D.; Dekker, James; He...
Electronic Components and Technology Conference (ECTC)2013

News in aseptic processing and packaging

Vertaisarvioitu
Ahvenainen, Raija; Mattila-Sandholm, Tiina; Ohlsson, Thomas
VTT Symposium1991

Towards traceable and sustainable plastic packaging: A perspective on recyclability of reusable smart packaging

Avoin saatavuus
Palola, Sarianna; Javanshour, Farzin; Laurikainen, Pekka; Hakola, Liisa; Hakola, Elina; Tenhunen-Lun...
4th CIRCUL-A-BILITY Conference: Re-thinking Packaging for Circular & Sustainable Food Supply Cha...2024

Modelling New Materials for Microelectronics Packaging

Vertaisarvioitu
Kivilahti, J.
IEEE Transactions on Components, Packaging and Manufacturing Technology - Part B1995

Hermetic fiber pigtailed laser module utilizing passive device alignment on an LTCC substrate

Vertaisarvioitu
DOI
10.1109/TADVP.2008.2007130
Keränen, Kimmo; Ollila, Jyrki; Mäkinen, Jukka-Tapani; Korhonen, Pentti; Kautio, Kari; Heikkinen, Vel...
IEEE Transactions on Advanced Packaging2009

Hermetic diode laser transmitter module

DOI
10.1117/12.345422
Ollila, Jyrki; Kautio, Kari; Vähäkangas, Jouko; Hannula, Tapio; Kopola, Harri; Oikarinen, Jorma; Siv...
Proceedings of SPIE1999

Hermetic diode laser transmitter module

Ollila, J.; Kautio, J.; Vähäkangas, T.; Hannula, H.; Kopola, Harri; Oikarinen, J. & Sivonen, M.
Proceedings of SPIE : the International Society for Optical Engineering1999

Note: Professionals' View of Consumers' Packaging Interactions - A Narrative Analysis:HUMAN-PACKAGING INTERACTION

DOI
10.1002/pts.2273
Ryynänen, Toni; Rusko, Elina
Packaging technology and science2016

Hermetic packaging for millimetre wave applications

Vertaisarvioitu
2013

Printed intelligence in packaging

2007

Hermetic wafer level packaging of MEMS components using through silicon via and wafer to wafer bonding technologies

Vertaisarvioitu
DOI
10.1109/ECTC.2013.6575770
2013

News in aseptic processing and packaging

Vertaisarvioitu
1991

Towards traceable and sustainable plastic packaging: A perspective on recyclability of reusable smart packaging

Avoin saatavuus
2024

Modelling New Materials for Microelectronics Packaging

Vertaisarvioitu
1995

Hermetic fiber pigtailed laser module utilizing passive device alignment on an LTCC substrate

Vertaisarvioitu
DOI
10.1109/TADVP.2008.2007130
2009

Hermetic diode laser transmitter module

DOI
10.1117/12.345422
1999

Hermetic diode laser transmitter module

1999

Note: Professionals' View of Consumers' Packaging Interactions - A Narrative Analysis:HUMAN-PACKAGING INTERACTION

DOI
10.1002/pts.2273
2016