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Low-temperature SLID-TSV Interconnects for 3D (MEMS) Packaging

Vertaisarvioitu
Avoin saatavuus
DOI
10.1109/TCPMT.2025.3528519
Emadi, Fahimeh; Liu, Shenyi; Vuorinen, Vesa; Paulasto-Krockel, Mervi
IEEE Transactions on Components, Packaging and Manufacturing Technology2025

3D flip chip packaging of MEMS sensor

Vertaisarvioitu
DOI
10.1109/ESTC.2014.6962737
Gädda, Akiko; Tuovinen, Reijo; Rimminen, Henry; Lalu, Sinikka; Saarilahti, Jaakko; Kärkkäinen, Anu
5th Electronics System-Integration Technology Conference, ESTC 20142014

Printed intelligence in packaging

Hurme, Eero; Sipiläinen-Malm, Thea
Paper360°2007

News in aseptic processing and packaging

Vertaisarvioitu
Ahvenainen, Raija; Mattila-Sandholm, Tiina; Ohlsson, Thomas
VTT Symposium1991

Towards traceable and sustainable plastic packaging: A perspective on recyclability of reusable smart packaging

Avoin saatavuus
Palola, Sarianna; Javanshour, Farzin; Laurikainen, Pekka; Hakola, Liisa; Hakola, Elina; Tenhunen-Lun...
4th CIRCUL-A-BILITY Conference: Re-thinking Packaging for Circular & Sustainable Food Supply Cha...2024

Modelling New Materials for Microelectronics Packaging

Vertaisarvioitu
Kivilahti, J.
IEEE Transactions on Components, Packaging and Manufacturing Technology - Part B1995

Note: Professionals' View of Consumers' Packaging Interactions - A Narrative Analysis:HUMAN-PACKAGING INTERACTION

DOI
10.1002/pts.2273
Ryynanen, Toni; Rusko, Elina
Packaging technology and science2016

Packaging as the gatekeeper

Avoin saatavuus
Joutsela, Markus
Good News from Finland2016

Consumer meaning -making of packaging functions for sustainable food packaging – Insights from qualitative research in Finland

Vertaisarvioitu
Avoin saatavuus
DOI
10.1016/j.crsust.2024.100259
Sonck-Rautio, Kirsi; Lahtinen, Taina; Tynkkynen, Nina
Current research in environmental sustainability2024

User-driven packaging design (case: KUPARI)

Avoin saatavuus
Kumpulainen, Kati; Nylander, Noora
The Publication Series of LAB University of Applied Sciences2021

Low-temperature SLID-TSV Interconnects for 3D (MEMS) Packaging

Vertaisarvioitu
Avoin saatavuus
DOI
10.1109/TCPMT.2025.3528519
2025

3D flip chip packaging of MEMS sensor

Vertaisarvioitu
DOI
10.1109/ESTC.2014.6962737
2014

Printed intelligence in packaging

2007

News in aseptic processing and packaging

Vertaisarvioitu
1991

Towards traceable and sustainable plastic packaging: A perspective on recyclability of reusable smart packaging

Avoin saatavuus
2024

Modelling New Materials for Microelectronics Packaging

Vertaisarvioitu
1995

Note: Professionals' View of Consumers' Packaging Interactions - A Narrative Analysis:HUMAN-PACKAGING INTERACTION

DOI
10.1002/pts.2273
2016

Packaging as the gatekeeper

Avoin saatavuus
2016

Consumer meaning -making of packaging functions for sustainable food packaging – Insights from qualitative research in Finland

Vertaisarvioitu
Avoin saatavuus
DOI
10.1016/j.crsust.2024.100259
2024

User-driven packaging design (case: KUPARI)

Avoin saatavuus
2021